● PCB Fabrication (Probe Card PCB)

PCB Fabrication (Probe Card PCB)-1
Max. Layers Material Max. Thickness Max. PCB Size Impedance Control Special

Process

100 FR-4

Nelco

Megtron

7.2mm 520 dia mm

558 x 558mm

50ohm

100ohm

Blind Via

Via In Pad

Back Drill

● PCB Fabrication (Load board PCB)

PCB Fabrication (Load board PCB)-1
Max. Layers Material Max.

Thickness

Max. PCB Size Impedance Control Min. Pitch Aspect Ratio Special

Process

68 FR-4

Nelco

Megtron

6.35mm 680 x 520mm 50ohm

100ohm

0.4mm 38:1 Blind Via

Via In Pad

Back Drill

● PCB Fabrication (Socket board PCB)

PCB Fabrication (Socket board PCB) -1
Max. Layers Material Max.

Thickness

Impedance Control Min. Pitch Aspect Ratio Special

Process

60 FR-4

Nelco

Megtron

6.35mm 50ohm

100ohm

0.32mm 32:1 Blind Via

Via In Pad

Back Drill

● PCB Fabrication (Burn in Board PCB)

PCB Fabrication (Burn in Board PCB)-2
Max. Layers Material Max.

Thickness

Max. PCB Size Impedance Control Special

Process

30 FR4 High Tg

POLYIMIDE

3.8mm 620 x 600mm 50ohm

100ohm

Blind Via

Via In Pad